B300W35A109A1G Datasheet, PDF (1/9 Pages) ON Semiconductor – Audio Processor for AfterMaster HD

BelaSigna 300 with
AfterMaster HD
Audio Processor for
AfterMaster HD
Introduction
BelaSigna^® 300 AM is a DSP−based audio processor which is able
to execute the AfterMaster HD algorithm within a system that also
includes a host processor and/or external 12S− based mono or stereo
A/D converters and D/A converters.
AfterMaster HD is an algorithm which processes audio signals in
real−time to provide a significant increase in loudness, clarity, depth,
and fullness.
BelaSigna 300 AM is specifically designed for use in applications
requiring a solution to overcome the limitations of small or
downward−facing speakers, including flat−screen televisions or
headphones.
This datasheet describes only the specific information required to
integrate BelaSigna 300 AM into an audio system.
For a more general description of the programmable BelaSigna 300
device from ON Semiconductor, please refer to the BelaSigna 300
datasheet.
Key Features
• Ultra−low−power: typically 4−8 mA when executing AfterMaster HD
• Miniature Form Factor: available in a miniature 3.63 mm x
2.68 mm x 0.92 mm (including solder balls) WLCSP package.
• Full Range of Configurable Interfaces: including a fast I²C−based
interface for download and general configuration of the
AfterMaster HD algorithm, a highly configurable PCM interface to
stream data into and out of the device, a high−speed UART, an SPI
port and 5 GPIOs
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
www.onsemi.com
WLCSP−35
W SUFFIX
CASE 567AG
MARKING DIAGRAM
BELASIGNA300
35−02−G
XXXXYZZ
BELASIGNA300 = Device Code
35
= Number of Balls
02
= Revision of Die
G
= Pb−Free
XXXX = Date Code
Y
= Assembly Plant Identifier
= (May be Two Characters)
ZZ
= Traceability Code
ORDERING INFORMATION
Device
Package
Shipping^†
B300W35A109A1G WLCSP 2500 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
March, 2015 − Rev. 0
Publication Order Number:
B300AM/D