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B300AM Datasheet, PDF (1/9 Pages) ON Semiconductor – Audio Processor for AfterMaster HD | |||
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BelaSigna 300 with
AfterMaster HD
Audio Processor for
AfterMaster HD
Introduction
BelaSigna® 300 AM is a DSPâbased audio processor which is able
to execute the AfterMaster HD algorithm within a system that also
includes a host processor and/or external 12Sâ based mono or stereo
A/D converters and D/A converters.
AfterMaster HD is an algorithm which processes audio signals in
realâtime to provide a significant increase in loudness, clarity, depth,
and fullness.
BelaSigna 300 AM is specifically designed for use in applications
requiring a solution to overcome the limitations of small or
downwardâfacing speakers, including flatâscreen televisions or
headphones.
This datasheet describes only the specific information required to
integrate BelaSigna 300 AM into an audio system.
For a more general description of the programmable BelaSigna 300
device from ON Semiconductor, please refer to the BelaSigna 300
datasheet.
Key Features
⢠Ultraâlowâpower: typically 4â8 mA when executing AfterMaster HD
⢠Miniature Form Factor: available in a miniature 3.63 mm x
2.68 mm x 0.92 mm (including solder balls) WLCSP package.
⢠Full Range of Configurable Interfaces: including a fast I2Câbased
interface for download and general configuration of the
AfterMaster HD algorithm, a highly configurable PCM interface to
stream data into and out of the device, a highâspeed UART, an SPI
port and 5 GPIOs
⢠These Devices are PbâFree, Halogen Free/BFR Free and are RoHS
Compliant
www.onsemi.com
WLCSPâ35
W SUFFIX
CASE 567AG
MARKING DIAGRAM
BELASIGNA300
35â02âG
XXXXYZZ
BELASIGNA300 = Device Code
35
= Number of Balls
02
= Revision of Die
G
= PbâFree
XXXX = Date Code
Y
= Assembly Plant Identifier
= (May be Two Characters)
ZZ
= Traceability Code
ORDERING INFORMATION
Device
Package
Shippingâ
B300W35A109A1G WLCSP 2500 / Tape &
(PbâFree)
Reel
â For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
March, 2015 â Rev. 0
Publication Order Number:
B300AM/D
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