848AB-01 Datasheet, PDF (1/2 Pages) ON Semiconductor – Electronic versions are uncontrolled except when accessed directly

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
6 PIN CLCC, 7x5, 2.54P
CASE 848AB-01
ISSUE C
SCALE 2:1
4X
0.15 C
D
A
D1
B
E2
TERMINAL 1
INDICATOR
H E1 E
0.10 C
A1
R
D2
TOP VIEW
A3
A2
A
SIDE VIEW
D3
1
2
e
3
C
SEATING
PLANE
E3
0.10 C A B
0.05 C 6X b
6
5
4
BOTTOM VIEW
6X L
SOLDERING FOOTPRINT*
6X
1.50
5.06
DATE 17 DEC 2007
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
MILLIMETERS
DIM MIN NOM MAX
A 1.70
1.80
1.90
A1
0.70 REF
A2
0.36 REF
A3 0.08
0.10
0.12
b 1.30
1.40
1.50
D
7.00 BSC
D1 6.17
6.20
6.23
D2 6.66
6.81
6.96
D3
5.08 BSC
E
5.00 BSC
E1 4.37
4.40
4.43
E2 4.65
4.80
4.95
E3
3.49 BSC
e
2.54 BSC
H
1.80 REF
L 1.17
1.27
1.37
R
0.70 REF
GENERIC
MARKING DIAGRAM*
XXXXXXXXX
XXXXXXXXXXXXX
AWLYYWWG
1
XXXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY
= Year
WW = Work Week
G
= Pb-Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb-Free indicator, “G” or microdot “ G”,
may or may not be present.
2.54
PITCH
6X
1.50
DIMENSION: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON23467D
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
“CONTROLLED COPY” in red.
©Ă Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, 2D0E0S2 C- ReIPv.T0ION: 6 PIN CLCC, 7X5, 2.54P
1
Case Outline Number:
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