523AE-01 Datasheet, PDF (1/2 Pages) ON Semiconductor – Electronic versions are uncontrolled except when accessed directly

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 4:1
UQFN12 1.7x2.0, 0.4P
CASE 523AE−01
ISSUE A
D
AB
ÉÉÉÉÉÉÉÉÉ ^{PIN 1 REFERENCE}
E
2X
0.10 C
L1
DETAIL A
NOTE 5
2X
0.10 C
TOP VIEW
0.05 C
DETAIL B
A
12X
0.05 C
A1
A3 _{SIDE VIEW}
C
SEATING
PLANE
DETAIL B
OPTIONAL
CONSTRUCTION
8X K
5
DETAIL A
7
e
1
12X L
11
L2
BOTTOM VIEW
12X b
0.10 M
0.05 M
CAB
C _{NOTE 3}
DATE 11 JUN 2007
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH 0.03
MAX ON BOTTOM SURFACE OF
TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D
1.70 BSC
E
2.00 BSC
e
0.40 BSC
K 0.20 ----
L 0.45 0.55
L1 0.00 0.03
L2
0.15 REF
GENERIC
MARKING DIAGRAM*
XXM
G
XX = Specific Device Code
M = Date Code
G = Pb−Free Package
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
2.00
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
1
0.32
2.30
11X
0.22
0.40
PITCH
12X
0.69
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER: 98AON23418D
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
“CONTROLLED COPY” in red.
© Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, D20E0S2C−RRIePvT. I0ON: UQFN12 1.7 X 2.0, 0.4P
1
Case Outline Number:
PAGE 1 OFX2XX