517BU-01 Datasheet, PDF (1/2 Pages) ON Semiconductor – Electronic versions are uncontrolled except when accessed directly

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 4:1
UDFN8 3.0x2.0, 0.5P
CASE 517BU−01
ISSUE O
D
AB
ÍÍÍ _{PIN 1}
REFERENCE
ÍÍÍÍÍÍ _{0.15 C}
0.15 C _{TOP VIEW}
0.05 C
DETAIL A
0.05 C
NOTE 4
A1
SIDE VIEW
(0.065)
E
(0.127)
DETAIL A
A
C
SEATING
PLANE
DATE 06 APR 2011
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
b 0.20 0.30
D
2.00 BSC
D2 1.35 1.45
E
3.00 BSC
E2 0.85 0.95
e
0.50 BSC
L 0.35 0.45
GENERIC
MARKING DIAGRAM*
D2
1
4
0.10 M C A B
8X L
0.10 M C A B
E2
8
5
e
BOTTOM VIEW
8X b
0.10 M C A B
0.05 M ^{C D NOTE 3}
RECOMMENDED
MOUNTING FOOTPRINT
1.56
XXX
ALL
YM
G
XXX = Specific Device Code
A = Assembly Location Code
LL = Assembly Lot
Y = Year
M = Month
G = Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
8X 0.63
PKG
OUTLINE
1.06
3.30
1
0.50
PITCH
8X
0.32
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER: 98AON55336E
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
“CONTROLLED COPY” in red.
© Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, 2D0E0S2 C− ReIPv.T0ION: UDFN8 3.0 X 2.0, 0.5P
1
Case Outline Number:
PAGE 1 OFX2XX