517BR-01 Datasheet, PDF (1/2 Pages) ON Semiconductor – Electronic versions are uncontrolled except when accessed directly

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 4:1
UDFN4 1.0x1.0, 0.65P
CASE 517BR−01
ISSUE O
D
A
B
4X L3
PIN ONE
REFERENCE
ÏÏÏÏ 2X
0.05 C
2X
0.05 C
TOP VIEW
0.05 C
E
(A3)
c 0.18
L2
typ
DETAIL A
3X 0.43
4X 0.23
0.05 C
NOTE 4
SIDE VIEW
A
A1
C
SEATING
PLANE
3X 0.10
DETAIL B
e
DETAIL A
1
e/2
3X L
2
DATE 27 OCT 2010
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A −−− 0.60
A1 0.00 0.05
A3 0.10 REF
b 0.20 0.30
D 1.00 BSC
D2 0.43 0.53
E 1.00 BSC
e 0.65 BSC
L 0.20 0.30
L2 0.27 0.37
L3 0.02 0.12
GENERIC
MARKING DIAGRAM*
XX
MM
1
D2
45 5
D2
4
3
4X b
0.05 M
BOTTOM VIEW
CA B
NOTE 3
XX = Specific Device Code
MM = Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT*
0.65
PITCH
DETAIL B
PACKAGE
OUTLINE
2X 0.52
1.30
0.53
4X 0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON53254E
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
“CONTROLLED COPY” in red.
© Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, 2D0E0S2 C− ReIPv.T0ION: UDFN4, 1.0X1.0, 0.65P
1
Case Outline Number:
PAGE 1 OFX2XX