513AL-01 Datasheet, PDF (1/2 Pages) ON Semiconductor – Electronic versions are uncontrolled except when accessed directly

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 1:1
TLLGA140 10x10, 0.5P, Dual−Row, Staggered−Pad
CASE 513AL−01
ISSUE O
DATE 20 OCT 2009
PIN ONE
LOCATION
D
ÉÉÉÉÉÉÉÉÉ
2X
0.15 C
2X
0.15 C
0.10 C
0.08 C
NOTE 3
TOP VIEW
SIDE VIEW
A
B
140X L
e
A39
e/2
B33
e
E
140X b
DETAIL A
A
A1
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.50 0.60
A1 --- 0.05
b 0.25 0.35
D 10.00 BSC
D2 5.70 5.90
E 10.00 BSC
E2 5.70 5.90
e
0.50 BSC
L 0.25 0.35
GENERIC MARKING
DIAGRAM
XXXXXXXXX
XXXXXXXXX
AWLYYWWG
0.15 C A B
D2
A20
B17
0.15 C A B
E2
B1
A1 _A76
B64
BOTTOM VIEW
140X L
A39
B33
DETAIL A
e e/2
140X b
0.10 C A B
0.05 C
B49
A58
XXXXX = Device Code
A
= Assembly Site
WL = Wafer Lot
YY = Year
WW = Work Week
G
= Pb−Free Package
RECOMMENDED
SOLDERING FOOTPRINT*
100X
0.35
A1
5.95
0.50
40X
PITCH ^0.48
10.10 5.95
100X
0.35
0.50
PITCH
0.25
10.10
40X
0.48
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON42332E
Electronic versions are uncontrolled except when
© Semiconductor Comp^Son^Te^Ant^Ts I^Und^Sus^:tries^O, LL^NC,^S20^E02^{MICONDUCTOR STANDA}1 ^RD
accessed directly from the Document Repository. Printed
versions are uncontrolled exceptCawsheeOnutslitnaemNpeudmber:
Octobe_Nr,_E2_W002_S−_TAR_Nev_D. _A01_RO_D:
“CONTROLLED COPY” in red.
485M
© Semiconductor Components Industries, LLC, 2002
http://onsemi.com
Case Outline Number:
October, D20E0S2C−RRIePvT. I0ON: TLLGA140, 10X10, 0.5P
1
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