511AB-01 Datasheet, PDF (1/2 Pages) ON Semiconductor – Electronic versions are uncontrolled except when accessed directly

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 2:1
WDFN8 3.3x3.3, 0.65P
CASE 511AB−01
ISSUE B
DATE 20 JAN 2009
2X
0.20 C
D
D1
87 65
A
B
2X
0.20 C
E1 E
0.10 C
0.10 C
1 2 34
TOP VIEW
SIDE VIEW
c
A
DETAIL A
6X
e
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH
PROTRUSIONS OR GATE BURRS.
4X
q
A1
C
SEATING
PLANE
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.70 0.75 0.80 0.028 0.030 0.031
A1 0.00 −−− 0.05 0.000 −−− 0.002
b 0.23 0.30 0.40 0.009 0.012 0.016
c 0.15 0.20 0.25 0.006 0.008 0.010
D
3.30 BSC
0.130 BSC
D1 2.95 3.05 3.15 0.116 0.120 0.124
D2 1.98 2.11 2.24 0.078 0.083 0.088
E
3.30 BSC
0.130 BSC
E1 2.95 3.05 3.15 0.116 0.120 0.124
E2 1.47 1.60 1.73 0.058 0.063 0.068
e
0.65 BSC
0.026 BSC
G 0.30 0.41 0.51 0.012 0.016 0.020
K 0.64 −−− −−− 0.025 −−− −−−
L 0.30 0.43 0.56 0.012 0.017 0.022
L1 0.06 0.13 0.20 0.002 0.005 0.008
M 1.40 1.50 1.60 0.055 0.059 0.063
q
0 _{_} −−− 12 _{_}
0 _{_} −−− 12 _{_}
8X b
0.10 C A B
0.05 c L
1
e/2
4
K
E2
M
G
8
5
D2
L1
BOTTOM VIEW
GENERIC
MARKING DIAGRAM*
1
XXXXX
AYWWG
G
XXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT*
8X
0.42
PACKAGE
OUTLINE
0.65
PITCH
4X
0.66
0.75 0.57
3.60
2.30
0.47
2.37
3.46
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON30561E
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD: REF TO JEDEC MO−240
“CONTROLLED COPY” in red.
© Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, 2D0E0S2 C− ReIPv.T0ION: WDFN8 3.3X3.3, 0.65P
1
Case Outline Number:
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