510AP-01 Datasheet, PDF (1/2 Pages) ON Semiconductor – Electronic versions are uncontrolled except when accessed directly

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WQFN42 3.5x9, 0.5P
CASE 510AP−01
ISSUE O
1
SCALE 2:1
D
PIN ONE
ÎÎÎÎÎÎÎÎ _REFERENCE
AB
E
L
L
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
0.15 C
0.15 C
TOP VIEW
0.10 C
A
A3
ÏÏÏÏ ^{EXPOSED Cu}
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTION
0.08 C
NOTE 4
DETAIL B
A1
SIDE VIEW
C
SEATING
PLANE
DATE 15 FEB 2010
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D
3.50 BSC
D2 1.95 2.15
E
9.00 BSC
E2 7.45 7.65
e
0.50 BSC
K 0.20 −−−
L 0.30 0.50
L1 0.00 0.15
GENERIC
MARKING DIAGRAM*
XXXXXXXX
XXXXXXXX
AWLYYWWG
0.10 C A B
DETAIL A
D2
K
17
22
42X L
42X b
0.10 C A B
E2
0.05 C NOTE 3
1
38
e
e/2
BOTTOM VIEW
0.10 C A B
XXXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
RECOMMENDED
MOUNTING FOOTPRINT
42X
0.63
9.30
3.80 2.16
0.50
PITCH
1
42X
0.35
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER: 98AON48316E
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
“CONTROLLED COPY” in red.
© Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, 2D0E0S2 C− ReIPv.T0ION: WQFN42 3.5X9, 0.5P
1
Case Outline Number:
PAGE 1 OFX2XX