510AK-01 Datasheet, PDF (1/2 Pages) ON Semiconductor – Electronic versions are uncontrolled except when accessed directly

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WQFN56 5x11, 0.5P
CASE 510AK−01
ISSUE A
DATE 02 MAR 2010
SCALE 2:1
D
AB
PIN ONE
ÉÉÉÉÉÉÉÉÉ _LOCATION
E
0.15 C
0.15 C
0.10 C
TOP VIEW
DETAIL B _(A3)
0.08 C
NOTE 4
A1
SIDE VIEW
0.10 C A
L
L
L1
DETAIL A
ALTERNATE
CONSTRUCTIONS
ÉÉÉÉ ^{EXPOSED Cu}
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.70 0.80
A1 −−− 0.05
A3 0.20 REF
b 0.20 0.30
D 5.00 BSC
D2 2.30 2.50
E 11.00 BSC
E2 8.30 8.50
e
0.50 BSC
K
0.20 MIN
L 0.30 0.50
L1 −−− 0.15
A
RECOMMENDED
GENERIC
SOLDERING FOOTPRINT
MARKING DIAGRAM*
C
SEATING
PLANE
B
5.30
2.50
56X
0.63
XXXXXXXX
XXXXXXXX
AWLYYWWG
DETAIL A
D2
56X L
1
XXXXX = Specific Device Code
0.10 C A B
A
= Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
8.50
11.30
G
= Pb−Free Package
E2
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
1
K
56
e
56X b
PKG
OUTLINE
0.50
PITCH
56X
0.35
DIMENSIONS: MILLIMETERS
e/2
0.10 C A B
BOTTOM VIEW
0.05 C NOTE 3
DOCUMENT NUMBER: 98AON45390E
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
“CONTROLLED COPY” in red.
© Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, 2D0E0S2 C− ReIPv.T0ION: WQFN56 5x11, 0.5P
1
Case Outline Number:
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