506AL Datasheet, PDF (1/2 Pages) ON Semiconductor – MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
8
1
SCALE 2:1
DFN8
CASE 506AL−01
ISSUE A
DATE 20 DEC 2005
D
A
B
ÏÏÏÏ _{PIN ONE}
REFERENCE
ÏÏÏÏÏÏÏÏ _{2 X}
ÏÏÏÏ ^{0.15 C}
TOP VIEW
2X
0.15 C
0.10 C
E
(A3) ^A
8X
0.08 C
SIDE VIEW
A1
D2
8X L
1
D2
4^e
SEATING
PLANE
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30mm.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN NOM MAX
A 0.80 0.90 1.00
A1 0.00 0.03 0.05
A3
0.20 REF
b 0.35 0.40 0.45
D
3.30 BSC
D2 0.95 1.05 1.15
E
3.30 BSC
E2 1.80 1.90 2.00
e
0.80 BSC
K 0.21 −−− −−−
L 0.30 0.40 0.50
GENERIC
MARKING DIAGRAM*
1
XXXX
AYWW
XXXX = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
8X K
STYLE 1:
PIN 1. IN
2. GND
3. CNTRL
4. DRAIN
5. SOURCE
6. GATE
7. OUT
8. VCC
8
5
BOTTOM VIEW
2 X E2
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
8X b
0.10 C A B
0.05 C NOTE 3
SOLDERING FOOTPRINT*
1
ÎÎÎÎÎÎ _2.95
ÎÎ _2X
ÎÎÎÎ 1.20
3.60
1.95
DIMENSIONS: MILLIMETERS
8X
0.55
ÎÎÎÎÎÎ _0.45
ÎÎ _0.80
ÎÎÎÎ PITCH
2X
0.60
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON20636D
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
“CONTROLLED COPY” in red.
© Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, 2D0E0S2 C− ReIPv.T0ION: DFN8, 3.3X3.3 MM, 0.8 MM PITC₁ H, DUAL FLAG
Case Outline Number:
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