483-02 Datasheet, PDF (1/2 Pages) ON Semiconductor – Electronic versions are uncontrolled except when accessed directly

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
5
1
SCALE 2:1
TSOP-5
CASE 483-02
ISSUE H
DATE 18 MAY 2007
NOTE 5
2X 0.10 T
D 5X
0.20 C A B
2X
0.20 T
5
4 _BS
1 23
L
G
A
M
K
DETAIL Z
J
C
0.05
H
SEATING
PLANE
T
DETAIL Z
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
MILLIMETERS
DIM MIN MAX
A
3.00 BSC
B
1.50 BSC
C 0.90 1.10
D 0.25 0.50
G
0.95 BSC
H 0.01 0.10
J 0.10 0.26
K 0.20 0.60
L 1.25 1.55
M
0 _ 10 _
S 2.50 3.00
GENERIC
MARKING DIAGRAM*
5
XXXAYWG
G
XX MG
G
2.4
0.094
1.0
0.039
0.7
0.028
ǒ Ǔ _{SCALE 10:1}
mm
inches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
1
Analog
1
Discrete/Logic
XXX = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G = Pb-Free Package
XX = Specific Device Code
M = Date Code
G = Pb-Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb-Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER: 98ARB18753C
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
©Ă Semiconductor Components Industries, LLC, 2002
October, D20E0S2C-RRIePvT. I0ON: TSOP-5
“CONTROLLED COPY” in red.
http://onsemi.com
1
Case Outline Number:
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