419C-02 Datasheet, PDF (1/2 Pages) ON Semiconductor – Electronic versions are uncontrolled except when accessed directly

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−82AB
CASE 419C−02
ISSUE E
SCALE 4:1
A
G
D 3 PL
4
S
1
3
B
2
F
L
C
N
K
H
J
0.05 (0.002)
SOLDERING FOOTPRINT*
1.30
0.0512
0.65
0.026
0.90
0.035
1.90
0.95 ^0.075
0.037
0.70
0.028
ǒ Ǔ _{SCALE 10:1}
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DATE 25 JAN 2006
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C−01 OBSOLETE. NEW STANDARD IS
419C−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A
1.8
2.2 0.071 0.087
B 1.15 1.35 0.045 0.053
C
0.8
1.1 0.031 0.043
D
0.2
0.4 0.008 0.016
F
0.3
0.5 0.012 0.020
G
1.1
1.5 0.043 0.059
H
0.0
0.1 0.000 0.004
J 0.10 0.26 0.004 0.010
K
0.1
−−− 0.004
−−−
L
0.05 BSC
0.002 BSC
N
0.2 REF
0.008 REF
S
1.8
2.4 0.07 0.09
GENERIC
MARKING DIAGRAM*
xxx M
1
xxx M
G
1
xxx = Specific Device Code
M = Month Code
G = Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER: 98ARB18939C
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, D20E0S2C−RRIePvT. I0ON: SC−82AB
“CONTROLLED COPY” in red.
http://onsemi.com
1
Case Outline Number:
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