English
Language : 

369AD-01 Datasheet, PDF (1/2 Pages) ON Semiconductor – 3.5 MM IPAK, STRAIGHT LEAD
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 1:1
E
L2
E3
L1
T
SEATING
PLANE
b1
2X e
3.5 MM IPAK, STRAIGHT LEAD
CASE 369AD−01
ISSUE A
DATE 17 FEB 2009
A
A1
D
L
A1
A2
3X b
0.13 M T
E2
D2
NOTES:
1.. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2.. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM TERMINAL TIP.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD GATE OR MOLD FLASH.
E2
D2
MILLIMETERS
DIM MIN MAX
A 2.19 2.38
A1 0.46 0.60
A2 0.87 1.10
b 0.69 0.89
b1 0.77 1.10
D 5.97 6.22
D2 4.80 −−−
E 6.35 6.73
E2 4.57 5.45
E3 4.45 5.46
e
2.28 BSC
L 3.40 3.60
L1 −−− 2.10
L2 0.89 1.27
OPTIONAL
CONSTRUCTION
DOCUMENT NUMBER: 98AON23319D
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
“ CONTROLLED COPY” in red.
© Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, D20E0S2C−RRIePvT. I0ON: 3.5 MM IPAK, STRAIGHT LEAD1
Case Outline Number:
PAGE 1 OFX2XX