2N7002K_12 Datasheet, PDF (1/6 Pages) Unisonic Technologies – 300mA, 60V N-CHANNEL ENHANCEMENT MODE MOSFET

2N7002K, 2V7002K
Small Signal MOSFET
60 V, 380 mA, Single, N−Channel, SOT−23
Features
• ESD Protected
• Low R_DS(on)
• Surface Mount Package
• 2V Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Low Side Load Switch
• Level Shift Circuits
• DC−DC Converter
• Portable Applications i.e. DSC, PDA, Cell Phone, etc.
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Rating
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
60
V
Gate−to−Source Voltage
V_GS
±20
V
Drain Current (Note 1)
Steady State 1 sq in Pad
I_D
T_A = 25°C
T_A = 85°C
mA
380
270
Drain Current (Note 2)
I_D
Steady State Minimum Pad T_A = 25°C
T_A = 85°C
mA
320
230
Power Dissipation
Steady State 1 sq in Pad
Steady State Minimum Pad
P_D
mW
420
300
Pulsed Drain Current (t_p = 10 ms)
Operating Junction and Storage
Temperature Range
I_DM
1.5
A
T_J, T_STG −55 to
°C
+150
Source Current (Body Diode)
I_S
300
mA
Lead Temperature for Soldering Purposes
T_L
260
°C
(1/8″ from case for 10 s)
Gate−Source ESD Rating
(HBM, Method 3015)
ESD
2000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq in pad size with 1 oz Cu.
2. Surface−mounted on FR4 board using 0.08 sq in pad size with 1 oz Cu.
http://onsemi.com
V_(BR)DSS
60 V
R_DS(on) MAX
1.6 W @ 10 V
2.5 W @ 4.5 V
I_D MAX
380 mA
SIMPLIFIED SCHEMATIC
Gate 1
3 Drain
Source 2
(Top View)
MARKING DIAGRAM
3
& PIN ASSIGNMENT
Drain
3
1
2
SOT−23
CASE 318
STYLE 21
704 MG
G
1
Gate
2
Source
704 = Specific Device Code*
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Specific Device Code, Date Code or overbar
orientation and/or location may vary depend-
ing upon manufacturing location. This is a
representation only and actual devices may
not match this drawing exactly.
ORDERING INFORMATION
Device
Package
Shipping^†
2N7002KT1G
SOT−23 3000 / Tape & Reel
(Pb−Free)
2V7002KT1G
SOT−23 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
May, 2012 − Rev. 10
Publication Order Number:
2N7002K/D