2N7002K Datasheet, PDF (1/5 Pages) Vishay Siliconix – N-Channel 60-V (D-S) MOSFET

2N7002K
Small Signal MOSFET
60 V, 380 mA, Single, N−Channel, SOT−23
Features
• ESD Protected
• Low R_DS(on)
• Surface Mount Package
• This is a Pb−Free Device
Applications
• Low Side Load Switch
• Level Shift Circuits
• DC−DC Converter
• Portable Applications i.e. DSC, PDA, Cell Phone, etc.
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Drain Current (Note 1)
Steady State
V_DSS
60
V
V_GS
±20
V
I_D
T_A = 25°C
T_A = 85°C
mA
320
230
t<5s
Power Dissipation (Note 1)
Steady State
t<5s
T_A = 25°C
T_A = 85°C
P_D
380
270
mW
300
420
Pulsed Drain Current (t_p = 10 ms)
Operating Junction and Storage
Temperature Range
I_DM
1.5
A
T_J, T_STG −55 to
°C
+150
Source Current (Body Diode)
I_S
300
mA
Lead Temperature for Soldering Purposes
T_L
260
°C
(1/8″ from case for 10 s)
Gate−Source ESD Rating
(HBM, Method 3015)
ESD
2000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Junction−to−Ambient − Steady State
(Note 1)
Symbol
R_qJA
Max
417
Unit
°C/W
Junction−to−Ambient − t ≤ 5 s (Note 1)
R_qJA
300
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in
sq [1 oz] including traces)
http://onsemi.com
V_(BR)DSS
60 V
R_DS(on) MAX
1.6 W @ 10 V
2.5 W @ 4.5 V
I_D MAX
(Note 1)
380 mA
Simplified Schematic
Gate 1
3 Drain
Source 2
(Top View)
MARKING DIAGRAM
& PIN ASSIGNMENT
3
Drain
3
1
2
SOT−23
CASE 318
STYLE 21
704 MG
G
1
Gate
2
Source
704 = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
2N7002KT1G
Package
SOT−23
(Pb−Free)
Shipping^†
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2008
1
July, 2008 − Rev. 4
Publication Order Number:
2N7002K/D