1SS400T1G_11 Datasheet, PDF (1/3 Pages) ON Semiconductor – High-Speed Switching Diode

1SS400T1G,
NSV1SS400T1G
High-Speed
Switching Diode
Features
• High−Speed Switching Applications
• Lead Finish: 100% Matte Sn (Tin)
• Qualified Maximum Reflow Temperature: 260°C
• Extremely Small SOD−523 Package
• AEC−Q101 Qualified and PPAP Capable
• NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T_A = 25°C)
Rating
Reverse Voltage
Forward Current
Peak Forward Surge Current
THERMAL CHARACTERISTICS
Symbol
V_R
I_F
I_FM(surge)
Max
100
200
500
Unit
V
mAdc
mAdc
Characteristic
Total Device Dissipation
FR−5 Board (Note 1) @T_A = 25°C
Derate above 25°C
Symbol
P_D
Max Unit
200
mW
1.57 mW/°C
Thermal Resistance, Junction-to-Ambient
R_qJA
635 °C/W
Junction and Storage Temperature Range
T_J, T_stg −55 to
°C
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ Minimum Pad.
ELECTRICAL CHARACTERISTICS
Characteristic
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(V_R = 80 Vdc)
Diode Capacitance
(V_R = 0 V, f = 1.0 MHz)
Forward Voltage
(I_F = 100 mAdc)
Reverse Recovery Time
(I_F = I_R = 10 mAdc)
Symbol
I_R
C_D
V_F
t_rr
Min Max
− 0.1
− 3.0
− 1.2
− 4.0
Unit
mAdc
pF
Vdc
ns
http://onsemi.com
1
CATHODE
2
ANODE
1
SOD−523
CASE 502
PLASTIC
MARKING DIAGRAM
AMG
G
1
A = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
1SS400T1G
SOD−523
(Pb−Free)
3000 / Tape &
Reel
NSV1SS400T1G SOD−523
(Pb−Free)
3000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
October, 2011 − Rev. 7
Publication Order Number:
1SS400T1/D