1SMB5956BT3G Datasheet, PDF (1/6 Pages) ON Semiconductor – 3 Watt Plastic Surface Mount Zener Voltage Regulators

1SMB59xxBT3G Series,
SZ1SMB59xxT3G Series
3 Watt Plastic
Surface Mount
Zener Voltage Regulators
This complete new line of 3 W Zener diodes offers the following
advantages.
Features
 Zener Voltage Range − 3.3 V to 200 V
 ESD Rating of Class 3 (> 16 kV) per Human Body Model
 Flat Handling Surface for Accurate Placement
 Package Design for Top Side or Bottom Circuit Board Mounting
 AEC−Q101 Qualified and PPAP Capable − SZ1SMB59xxT3G
 SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
 Pb−Free Packages are Available*
http://onsemi.com
PLASTIC SURFACE MOUNT
ZENER VOLTAGE
REGULATOR DIODES
3.3−200 V, 3 W DC POWER
SMB
CASE 403A
PLASTIC
Mechanical Characteristics:
CASE: Void-free, transfer-molded plastic
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
LEADS: Modified L−Bend providing more contact area to bond pads
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MAXIMUM RATINGS
Rating
Symbol Value Unit
Maximum Steady State Power
Dissipation @ T_L = 75C
Measured at Zero Lead Length
Derate Above 75C
Thermal Resistance from Junction−to−Lead
Maximum Steady State Power
Dissipation @ T_A = 25C (Note )
Derate Above 25C
Thermal Resistance from
Junction−to−Ambient
P_D
R_qJL
P_D
R_qJA
3.0
W
40 mW/C
25 C/W
550 mW
4.4 mW/C
226 C/W
Operating and Storage Temperature Range
T_J, T_stg −65 to C
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 board, using recommended footprint.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
1
January, 2012 − Rev. 8
Cathode
Anode
MARKING DIAGRAM
AYWW
9xxB G
G
A = Assembly Location
Y = Year
WW = Work Week
9xxB = Device Code (Refer to page 3)
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
1SMB59xxBT3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
SZ1SMB59xxBT3G SMB
(Pb−Free)
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Publication Order Number:
1SMB5913BT3/D