1212-01 Datasheet, PDF (1/2 Pages) ON Semiconductor – Electronic versions are uncontrolled except when accessed directly

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 2:1
SOT−23 5−LEAD
CASE 1212−01
ISSUE A
A
D
5
4
E
12 3
L1
e
B
A2
0.05 S
E1
5X b
C
0.10 M C B S A S
C
A
A1
L
RECOMMENDED
SOLDERING FOOTPRINT*
DATE 28 JAN 2011
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DATUM C IS THE SEATING PLANE.
MILLIMETERS
DIM MIN MAX
A --- 1.45
A1 0.00 0.10
A2 1.00 1.30
b 0.30 0.50
c 0.10 0.25
D 2.70 3.10
E 2.50 3.10
E1 1.50 1.80
e
0.95 BSC
L 0.20 ---
L1 0.45 0.75
GENERIC
MARKING DIAGRAM*
3.30
5X
0.85
5X
0.56
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
XXX MG
G
XXX = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER: 98ASH70518A
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, D20E0S2C−RRIePvT. I0ON: SOT−23 5−LEAD
“CONTROLLED COPY” in red.
http://onsemi.com
1
Case Outline Number:
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