G3VM-S1 Datasheet, PDF (5/8 Pages) Omron Electronics LLC – MOS FET Relay

G3VM-S1
DC Parallel Connection
Ê´
1
6
Load
Ê´
2
5
DC
ʵ
ʵ
3
4
Solder Mounting
Maintain the following conditions during manual or reflow solder-
ing of the relays in order to prevent the temperature of the relays
from rising.
1. Pin Soldering
Solder each pin at a maximum temperature of 260°C within
10 s.
2. Reflow Soldering
a. Solder each pin at a maximum temperature of 260°C
within 10 s.
b. Make sure that the ambient temperature on the surface
of the resin casing is 240°C max. for 10 s maximum.
c. The following temperature changes are recommendable
for soldering.
Temperature (°C)
240 _{5°C/s max.Ë} 
210
150
60 s
Time (sec)
10 s
max.
30 s max.
G3VM-S1
5