XB4A Datasheet, PDF (3/6 Pages) Omron Electronics LLC – 0.4-mm Pitch Board to FPC Connector

Safety Precautions
Precautions for Correct Use
For Operating
1. Regarding the connector stacking operation, it should be con-
firmed there is no extreme displacement and tilt in the stacking
contact areas between a plug and a socket before the stacking
operation of the connectors.
2. Ensure that the connector stackings are fully seated.
• An incomplete stacking state may cause the failure of contact
reliability.
3. Do not apply an extreme load when inserting or drawing out the
connector.
• The connector may be damaged, resulting in faulty contacts.
4. When stacking the plug and socket, press the back side of printed
circuit board mounted with them and then couple with as little
twisting force as possible.
• Doing so may cause the terminal and housing to change shape
or the housing to crack.
5. When drawing out, hold the edge of the printed circuit board near
the connector and remove as vertically as possible, as described
in the figure below.
• Drawing out the plug with too much force may have possibility to
change shape of terminal solder/housing crack.
Row direction
6. Do not insert a foreign object such as a tweezers into the connec-
tor stacking contact area.
• Doing so may cause the plating peel off and deform the shape
of the terminal.
For Mounting
1. The reflow conditions are as stated in OMRON’s specifications
and guidelines.
These conditions, however, depend on the type of solder, the
manufacturer, the amount of solder, the size of the circuit board,
and the other mounting materials.
2. When mounting the connector by manual soldering, observe the
following precautions to ensure contact reliability.
• Conditions for manual soldering: 350±10°C 3±1 sec
• Do not apply an excessive amount of solder. Excessive solder
will cause the flux creap.
• Do not apply the soldering iron to the mounting terminal. Doing
so may cause the connectors to change shape.
• Do not apply the soldering iron to any parts of the connector
other than the mount attachments. Doing so may cause the con-
nector to change shape.
For Designing
1. When mounting the connector to the FPC, design the FPC so that
extreme peel force should not be applied directly on to the con-
nector.
If the FPC bends near the connector, or if the FPC is used with
extreme peel force directly on to the connector, it may cause a
contact loss.
2. If the connector-mounted FPC is installed at a location or in any
equipment that will subject the FPC to continuous shake or move-
ment, secure the FPC or take any countermeasure against FPC
disconnection from the connector.
3. Do not use plural connectors on same PCB.
• Doing so may cause solder and housing crack.
4. When locating the connector on the printed circuit board, be sure
to allow space for the stacking operation.
5. Ensure a metal mask thickness of t = 0.10 to 0.15 mm.
The recommended open area of the metal mask is 90% of the
printed circuit board’s mating dimensions as shown in the dimen-
sional diagrams.
Pitch direction
0.4-mm Pitch Board to FPC Connector XB4A/XB4B
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