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E32-M21 Datasheet, PDF (18/67 Pages) Omron Electronics LLC – Fiber Sensors Best Selection Catalog
Features/Applications
Application-corresponding Models
Wafer Mapping
• Wafers are reliable detected with an ultrafine beam.
• The optical axis is adjusted before delivery to allow
easy installation.
E32-A03
■ Features
Optical axis adjusted
before delivery so
that displacement is
typically within 0.1°. Direction of rotation
E32-A03-1
■ Overview of Model Variations
Vertical rotation
■ Engineering Data
8-inch Wafer Mapping Characteristic (Typical Examples)
180
160
Wafer piles can
also be detected
140
120
100
80
170 mm
60
40
For
2 wafers
20
For
1 wafer
Fiber
6.35 mm
2-wafer pile
0
−10 −9 −8 −7 −6 −5 −4 −3 −2 −1 0 1 2 3 4
Distance moved, X (mm)
X Fiber
Silicon wafer
(t = 0.75 mm)
Type
Features
Shape, sensing distance (mm)*
Model number
Opening angle: 1.5°
With mounting
flange
E32-A03
890
E32-A03-1
Opening angle: 3° ultraslim
With mounting
flange
E32-A04
340
E32-A04-1
*The sensing distances apply for use in combination with the E3X-DA-S Amplifier Unit (general-purpose, standard mode).
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