English
Language : 

B3DA Datasheet, PDF (1/6 Pages) Omron Electronics LLC – Ultra-low Profile Dome Array
Ultra-low Profile Dome Array
B3DA
Ultra-low Profile Dome Array With Dust-Proof
Construction and Crisp Clicking Action
• No soldering required. Attach directly to PCB to make an ultra-low
profile tactile switch.
• Matrix adhesive used to create highly dust-proof construction
with good ventilation. Omron's unique circular contact action
ensures a high level of resistance to foreign matter.
• Lower profile, lighter weight, and crisp clicking action.
• Customization of Dome Array available upon request
(i.e., silver plating, number of contacts, shape, etc.).
• RoHS Compliant.
Ordering Information
Item
4 mm dome array
5 mm dome array
Note: Representative versions for engineering evaluation.
Specifications
Model (see note)
B3DA-0010-A
B3DA-0000-A
Item
Diameter of contact dome
Operating force (OF)
Releasing force (RF)
Pretravel (PT)
Height
Life expectancy
Switching capacity
Minimum permissible load
Ambient operating temperature
Ambient storage humidity
Contact - base material
Plating
Model
B3DA-0010-A
and custom 4 mm dia. versions
B3DA-0000-A
and custom 5 mm dia. versions
4-mm dia.
5-mm dia.
approx. 160 ± 50 gf (1.57± 0.49 N)
20 gf min. (0.2 N min.)
0.2 ± 0.1 mm
0.25 ± 0.1 mm
500,000 operations min.
1,000,000 operations min.
10 mA at 12 VDC (resistive)
1 mA at 3 VDC (resistive)
-40 to 80°C (at 60% RH max.) with no icing or condensation.
10% to 90% (at 40°C max.)
Stainless steel
Unplated. (Silver plating available for custom models.)
Note: Contact dome specifications not shown in this table are also available. Consult Omron for customization requirements.
■ Recommended Contact Form on PCB
4-mm Diameter Contact Dome
Single-side PCB
Multilayer PCB
5.2 dia.
1.8 dia.
Gold-plated nickel
5.2 dia.
1.8 dia.
Gold-plated
nickel
5-mm Diameter Contact Dome
Single-side PCB
6.2 dia.
2.3 dia.
Gold-plated nickel
Multilayer PCB
6.2 dia.
2.3 dia.
Gold-plated
nickel
0.4
1.2 2.0
0.4
1.2 2.0
2.8 dia.
Resist (30 to 50 µm)
2.8 dia.
3.8 dia.
Resist (30 to 50 µm) 3.8 dia.
Ultra-low Profile Dome Array B3DA 273