English
Language : 

MB2S Datasheet, PDF (1/2 Pages) General Semiconductor – MINIATURE GLASS PASSIVATED SINGLE-PHASE SURFACE MOUNT BRIDGE RECTIFIER
Email: info@olitech-elec.com Website: www.olitech-elec.com
MB2S THRU MB10S Silicon Bridge Rectifiers
Single Phase 0.8 AMPS. Voltage Range 200to 1000Volts
Features
• Ideal for printed circuit board
• Reliable low cost construction technique
results in inexpensive product
• High temperature soldering guaranteed:
260℃ / 10 seconds / 0.375” ( 9.5mm )
lead length at 5 lbs., ( 2.3 kg ) tension
Mechanical Data
• Case: Molded plastic
• Lead: solder plated
• Polarity: As marked
Weight:0.115 grams
-
~
MBS
+
.157(4.00) .276(7.0)
.142(3.60)
MAX
.083(2.12)
.043(1.10)
.008(0.20)
MAX
~
.014(0.35)
.006(0.15)
.208(5.30)
.205(5.20)
5
.102(2.60)
.087(2.20)
.193(4.90)
.177(4.50)
.053(1.53)
.037(0.95)
.043(1.10)
.028(0.70)
.062(1.60)
.054(1.40)
.106(2.70)
.090(2.30)
.118(3.0)
MAX
.033(0.84)
.022(0.56)
Dimensions in inches and (millimeters)
.053(1.53)
.037(0.95)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25℃ ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
MB2S
MB4S
MB6S
MB8S
MB10S
UNITS
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC blocking Voltage
VRRM
200
400
600
800
1000
V
VRMS
140
280
420
560
700
V
VDC
200
400
600
800
1000
V
Maximum Average Forward Rectified Current
On glass-epoxy P.C.B.
On aluminum substrate
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
Maximum Instantaneous Forward Voltage @ 0.5A
Maximum DC Reverse Current @ TA=25℃
rated DC blocking voltage per leg TA = 125℃
Typical junction capacitance per leg at 4.0V.1MHz
Typical Thermal Resistance (Note1)
(Note2)
Operating Temperature Range
I(AV)
IFSM
VF
IR
CJ
RθJA
RθJL
TJ
0.5
0.8
30
1.0
5.0
500
13
70
20
-55 to +150
A
A
V
μA
pF
℃/W
℃
Storage Temperature Range
TSTG
-55 to +150
℃
NOTE:1.On aluminum suvstrate P.C.B. with an area of 0.8×0.8”(20×20mm) mounted on 0.05×0.05”(1.3×1.3mm) solder pad.
2.On glass epoxy P.C.B. mouted on 0.05×0.05”(1.3×1.3mm) pads.
OLITECH ELECTRONICS CO. LTD.
Page:P2-P1