ML70512 Datasheet, PDF (26/29 Pages) OKI electronic componets – Bluetooth Baseband Controller IC

OKI Semiconductor
PACKAGE DIMENSIONS
ML70512HB - 83pinWCSP (P-VFLGA83-6.22 × 6.22-0.50-W)
P-VFLGA83-6.22×6.22-0.50-W
FEDL70512-04
ML70512
(Unit: mm)
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
Sn/Pb
Solder plating (≥5µm)
0.04 TYP.
1/July 5, 2002
Note: A lead-free package is available. Please contact Oki Sales Office/Distributors for more information.
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
26/29