RW1S0BA Datasheet, PDF (2/4 Pages) Ohmite Mfg. Co. – RC Series carbon composition

Surface Mount Power
p e r fo r m a nc e d a t a


Construction
Temp. cycle Load Life
(-55°C to 125°C, (1000 hours
1000 cycles) at 25°C)
Immersion
(260°C for Momentary
10 sec.) Overload
RC Carbon/Ceramic Comp. ±4.0%+.05Ω ±10.0%+.05Ω ±3.0%+.05Ω 6.3x rated power for 5 sec.
RF Metal Film
±0.5%+.05Ω ±0.5%+.05Ω ±0.1%+.05Ω 2x rated power for 0.1 sec.
RW Wirewound
±0.5%+.05Ω ±3.0%+.05Ω ±0.1%+.05Ω 5x rated power for 5 sec.
RP Power Film
±3.0%+.05Ω ±5.0%+.05Ω ±0.5%+.05Ω 2x rated power for 0.1 sec.
RN Wirewound, Non-inductive ±0.5%+.05Ω ±3.0%+.05Ω ±0.1%+.05Ω 5x rated power for 5 sec.
ALL models:


Leaching (260°C Solder immersion, 60 sec.).......................
Thermal Shock (Units at -55°C, then rated power applied)..
Flammability .........................................................................
No visible leaching
No mechanical damage
UL Material rating, UL94V0
Derating
100
80
60
40
20
0
0 25 50 75 100 125 150
Ambient Temperature, ϒC
TCR
Recommended Solder Profile
500
400
Typical TCR for
less than 0.1Ω SMD
300
resistors (PPM/°C)
200
100
0.02 0.04 0.06 0.08 0.10
Ohms
300
Soldering
10 sec.
250
200 _Preheating
120 sec.
150
60 sec.
Cooling
100
50
0
0 50 100 150 200 250
Time (sec.)
Preheating: 145°C ±15°, max. 120 sec.
Soldering: min. 220°C, max. 60 sec.
Max. Temp.: 260°C ±5°, 10 sec.
200
Package limit hot spot temperature rise
180
Alumina
160
FR4
140
The temperature rise graph
data was obtained by a
selection of test substrate
size and trace width for
each resistor size to limit
operating temperatures to
safe values.
120
The operating temperature
safe rises are either 100°C
100
substrate temperature rise
or 180°C package hot spot
80
temperature rise at 25°C
ambient.
60
FR4: 0.062 in. thick; 0.062
in. traces
40
20
Solder joint
Alumina: 0.040 in. thick;
0.010 in. traces
Molding material rated at
205°C continuous.
100%
200%
300%
Percent Rated power
32
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