SINK-E Datasheet, PDF (1/2 Pages) Ohmite Mfg. Co. – Vertical through-hole PCB mounting

E Series Heatsinks
For TO-220 devices
F e a t u r es
• Vertical through-hole PCB mounting
• 0.142 in. diameter mounting holes (3)
S E RI E S S P E CI F ICATI O N S

For
Ohmite
Surface
Heatsink
Part Number
Package
Type
Resistor
Series
Area
(in²)
Weight
EEVA--TT222200--3388EE TO _{-220 TB H25, TCH35 11.5 0.63 oz/18g}
EEAV--TT222200--5511EE TO ^{-220 TB H25, TCH35 15.2 0.85 oz/24g}
EEAV--TT222200--6644EE TO ^{-220 TB H25, TCH35 18.8 1.06 oz/30g}
*Natural convection at 10W dissipation
Thermal
Resistance*
(°C/W)
11.4
9.5
9.0
7.5
7.4
6.2
characteristics
Heat sink Aluminum 6063-T5 or equiv-
alent with either black anod-
ized or degreased finish
Solder feet Tin plated brass
Interface for improvement, use thermal
thermal joint compound or 0.005
resistance Grafoil (TGon 800 by Laird)
Interface Sil-Pad 900S by Bergquist or
electrical equivalent
isolation
Heat Dissipation
0
100
200
-E38
80
-E51
60
-E64
40
Air Velocity (ft./min.)
400
600
20
800
1000
10
-E38
8
-E51
6
-E64
4
2
0
0
0
2
4
6
8
10
Heat Dissipated (watts)
174
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax [phone] • www.ohmite.com • [e-mail]
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