SINK-CSM Datasheet, PDF (1/2 Pages) Ohmite Mfg. Co. – The economically priced CSM Series is suitable

CSM Series
Board Mount Heat Sink
For TO-220 Devices
The economically priced CSM Series is suitable for
use with TO-220 devices found in active components
as well as power resistors. With surface areas rang-
ing from 1188 Sq. mm to 6645 Sq. mm, the CSM
family comes in 5 configurations, all of them with
Black Anodized surface treatment. These heatsinks
offer a range of thermal performance from 18.0 to
9.8 C/W. Each device offers solder able mounting
feet and anywhere from 1, 2 or 3 mounting holes are
available for convenient device attachment.
SERIES S P ECI F ICATI O N S
Heatsink
Part Number
Surface Area
(in² / mm²)
CSM221-12AE
CSM221-28AE
CSM221-40AE
CSM222-30AE
CSM223-50AE
1.84 / 1,188
4.30 / 2,772
6.14 / 3,960
6.25 / 4,029
10.30 / 6,645
*Free convection at 10 watts dissipation
Weight
(oz / g)
0.13/ 3.7
0.3 / 8.5
0.43 / 12.2
0.5 / 14.2
0.6 / 17.0
Length L Thermal
(mm) Res.* (°C/W)
12
18.0
28
12.8
40
12.1
30
11.3
50
9.8
characteristics
Heat Dissipation
Heat dissipation is the total for ALL DEVICES attached to
the heat sink
Air Velocity (ft./min.)
300 400 500 600 700 800 900 1000
150
10
135
9
120
8
105
7
90
6
75
5
60
4
45
CSM221-12AE
3
30
CSM221-28AE
2
CSM221-40AE
15
1
0
0
0
2
4
6
8
10
12
14
Heat Dissipated (watts)
Heat Sink Aluminum Alloy 6063-T5 or Equivalent
with either degreased or black anodized
finish.
Solder Foot Cold-rolled Steel, surface tin plated.
Interface for improvement, use thermal joint com-
Thermal pound, 0.005 Grafoil (TGon 800 by Laird),
Resistance or phase change material (Hi-Flow by
Bergquist)
Insulator (Optional) Sil-Pad 900-S, K6 800-S and
K10 by Bergquist
Air Velocity (ft./min.)
300 400 500 600 700 800 900 1000
150
10
135
9
120
8
105
7
90
6
75
5
60
4
45
3
30
CSM222-30AE
CSM223-50AE
2
15
1
0
0
0
2
4
6
8
10
12
14
Heat Dissipated (watts)
(continued)
164
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