RES-TEH100 Datasheet, PDF (1/2 Pages) Ohmite Mfg. Co. – Low thermal resistance

TEH100 Series
100 Watt Thick Film Power Resistors for High
Frequency and Pulse Loading Applications
Ohmite offers the totally
encapsulated and insulated
TO-247 package for low
ohmic value and non-induc-
tive design for high-frequen-
cy and pulsing applications.
Ideal use is for power sup-
plies. This series is rated
at 100 Watts mounted to a
heat sink.
F e a t u r es
• 100 Watt power rating at
25°C case temperature
• Non-inductive performance
• Low thermal resistance
• RoHS compliant design
• TO-247 package configura-
tion
• Single screw mounting
simplifies attach-ment to
the heat sink
• A totally molded housing
for enviromental protection
• Non-Inductive design
• Resistor package totally
insulated from heat sink
c h a r a c te r i st i c s
Resistor thick film on alumina
Case high temperature plastic
Lead Material Tinned Copper
Installation, max. 0.9 Nm using an M3 screw and a
Torque compression washer
Derating linear, 100% at 25°C to 0% at
175°C
Resistance range 0.05Ω to 1MΩ, other values on
request
Resistance tol. ±1%, ±2%, ±5%, ±10%
Max. working voltage 350V
Temperature
Coefficient
>10Ω: 50ppm/°C, ref. to 25°C
3 to 10Ω: 100ppm/°C
1 to 2.99Ω: 250ppm/°C
<1Ω: 500-1000+ppm/°C (Contact
factory for exact values below
1Ω)
Insulation Resistance 10GΩ min.
Dielectric Strength 1,800 VAC
Test Conditions Of Test
Performance
Load life MIL-R-39009D 4.8.13 , 2,000
hours at rated power
∆R ≤ ±(1.0% + 0.0005Ω)
Moisture resis- -10°C - +65°C, RH>90%, cycle ∆R ≤ ±(0.50% + 0.0005Ω)
tance 240 h
Short time 1.5 times rated power and
∆R ≤ ± (0.50% + 0.0005Ω)
overload V(DC) ≤1.5Vmax for 5 seconds
Thermal shock GJB360A-96 method 107,
Cond. F
∆R ≤ ±(0.50% + 0.0005Ω)
Dielectric GJB360A-96 method 301,
strength (1,800V AC, 60s)
∆R ≤ ± (0.15% + 0.0005Ω)
Terminal GJB360A-96 method 211,
strength Cond. A (Pull Test) 2.4N
∆R ≤ ±(0.20% + 0.0005Ω)
High frequency GJB360A-96 method 204,
vibration Cond. D
∆R ≤ ±(0.40% + 0.0005Ω)
Derating
100
80
THIS PRODUCT IS DESIGNED FOR
USE WITH PROPER HEATSINKING.
Maximum base plate temperature of the resistor must be
monitored and kept within specified limits to establish
the power rating. Best technique is to attach a ther-
mocouple to the side of the base plate of the resistor.
Temperature of plastic housing or heat sink cannot be
used to establish rating of the resistor.
60
40
20
0
0
25 50 75 100 125 150 175
Bottom of base plate Temperature, °C
Derating (thermal resistance): 0.666W/°K (1.5K/W). Without a heatsink, when in free air at
25°C, the TEH100 is rated for 3.5W. Derating for temp. above 25°C is 0.0234W/°K.
Graphed value is only valid when using a thermal conduction to the heatsink Rth-
cs<0.025°K/W. This value can be reached by using thermal transfer compound with a
heat conductivity of 1W/mK. The flatness of the cooling plate must be better than 0.05mm
overall. The roughness of the surface should not exceed 6.4µm. The case temperature is
to be used for the definitiion of the applied power limit. The case temperature measurement
must be made with a thermocouple contacting the center of the component mounted on the
designed heat sink. Thermal grease should be applied properly
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