RES-TAP800 Datasheet, PDF (1/2 Pages) Ohmite Mfg. Co. – Materials meet the requirements of UL94-V0

TAP800 Series
800 Watt Heat Sinkable Planar
F e at u r e s
• Electric support is high alumina content ceramic
metallized on the bottom for ideal heat transfer and
optimum discharge.
• Encapsulated with a special resin filled epoxy cas-
ing with a large creepage distance to mass, large
air distance between terminals, and a high insula-
tion resistance (CTI 600).
• Resistive element is specially designed for low
inductance and capacitance. The element provides
stable performance in addition to high wattage and
pulse loading capability.
• Contacts allow for easy load connecting with M4 or
M5 screws (not included).
• Materials meet the requirements of UL94-V0
Ohmite’s TAP800 Series dissipates 800 watts of
power when used with a liquid or air cooled heat
sink system. The Ohmite CP4 (http://www.ohmite.
com/cat/sink_cp4.pdf) is an example of properly
designed heat sink. The TAP800 rounds out 600
watt (TAP600) and 1000 watt (TAP1000) prod-
uct offerings. Applications include variable speed
drives, power supplies, robotics, motor control, con-
trol devices, and other power designs.
c h a r a c t e r i st i c s
Resistance Values 1Ω to 10KΩ
Resistance Tolerance ±5% to ±10%
Temperature Coefficient ±150ppm/°C (others upon request)
Maximum Working 5,000V DC, higher voltage on request, not exceeding
Voltage max. power
Short Time Overload 1,200W at 70°C for 10sec., ∆R=0.4% max.
Power Rating 800W at 85°C Bottom case temperature.
Peak Current up to 1500 amp. depending on pulse length and fre-
quency Please ask for details
Electric Strength Voltage 6kVrms, 50Hz,upto 12kVrms on special request
Single Shot Voltage up to 12kV Normwave (1.5/50 µsec)
Partial Discharge 4KVrms, <10pC, up to 7kV on special request
Insulation Resistance 10GΩ min. at 500V
Creeping Distance 42mm min.
Air Distance 14mm min.
Inductance 80nH
Capacity/Mass 110pF
Capacity/Parallel 40pF
Operation Temperature -55°C to +150°C
Max. Torque for 2 Nm
Contacts
Max. Torque for 1.8 Nm M4 screws (not included)
Mounting
Derating 9.09W/°K (0.11°K/W)
Power Rating 800W at 85°C bottom case temp. This value is only
valid by using a thermal conduction to the heatsink
Rth-cs<0.025°K/W. This value can be reached by
using thermal transfer compound with a heat conduc-
tivity of 1W/mK. The flatness of the cooling plate must
be better than 0.05mm overall. The roughness of the
surface should not exceed 6.4µm.
Test Method
Short time 1,000 W/10sec
overload
Humidity 56 days/40°C/95%
Steady State
Temp. Cycling -55/+125/5 cycles
Shock 40g/4,000 times
Vibration 2-500Hz/10g
Load Life Pn 30 min. on/30 min
off, 1,000cyl
Terminal 200N
Strength
Typical
Results
∆R
0.4%
0.25%
0.20%
0.25%
0.25%
0.40%
0.05%
Derating
120
960
100
800
80
640
60
480
40
320
20
160
0
0
0
25
50
75 100 125 150 175
Bottom of base plate Temperature, °C
(continued)
142
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