RES-AS-SMD Datasheet, PDF (1/2 Pages) Ohmite Mfg. Co. – Reduction of assembly costs

AS Series
Anti-surge Thick Film Chip Resistors
F e at u r e s
• Small size and light weight
• Suitable for both wave and reflow soldering
• Can withstand high surge
• Reduction of assembly costs


Type
AS08 (0805)
AS12 (1206)
AS25 (2512)
Series specifications
Power
Rating
at 70°C
0.33W
0.5W
1.5W
Max
Working
Voltage
150V
200V
500V
Max
Overload
Voltage
300V
400V
500V
Dielectric
Withstanding
Voltage
500V
500V
500V
Resistance
Range
1Ω~10MΩ
1Ω~10MΩ
1Ω~20MΩ
Std. Oper. Temp. -55°C ~ +155°C
Standard Values E-24 values
Construction Thick film
Tolerance ±5% standard; ±10%
and ±20% available
Derating
100
80
60
40
20
0
-55
0
50 70 100
155
Ambient Temperature, °C
Reflow
300
Soldering^{2302°0~±1204s5e°/c2.50°}
250 _Preheating
150° ~ 180°
200
90 ±30sec.
Cooling
150
100
50
0
Time
Characteristics
Test
Temperature
Coefficient
Short Time
Overload
Terminal
Bending
Soldering Heat
Single Pulse
Humidity
Load Life in
Humidity
Load Life
Solderability
Temperature
Cycling
Dielectric
withstanding
voltage
ΔR
1Ω-10Ω: ≤ ±400PPM/°C
(±200 PPM can be provid-
ed on a case to case basis)
11Ω-10MΩ: ≤ ±100PPM/°C
±(1.0% + 0.1Ω) max.
±(1.0% + 0.05Ω) max.
±(1.0% + 0.05Ω) max.
±(1.0% + 0.1Ω) max.
±(3.0% + 0.1Ω) max.
±(3.0% + 0.1Ω) max.
±(3.0% + 0.1Ω) max.
Min. 95% coverage
±(1.0% + 0.05Ω) max.
No evidence of flashover,
mechanical damage, arcing
or insulation breakdown
Test Methods (JIS C 5201-1 )
Natural ΔR/°C
R2-R1
R1(t2-t1)
x 10⁶ (PPM/°C)
R1: at room temp. (T1)
R2: at room temp. plus 100°C (T2)
Test pattern: room temp. (T1), room
temp. +100°C(T2)
Permanent ΔR after the application of a
potential of 2.5 times RCWV for 5 sec.
Twist of Test Board: Y/X = 3/90 mm for
60 sec.
260°C±3°C for 10 ±1 sec.
See graph on next page.
Temporary ΔR after 240 hr. at 40 ±2°C
and 90-95% relative humidity
ΔR after 1,000 hr. (1.5 hr. "on", 0.5 hr.
"off" ) at RCWV at 40 ±2°C and 90-95%
relative humidity
ΔR change after 1,000 hr. operat-
ing at RCWV, with duty cycle of (1.5
hours"on", 0.5 hour"off") at 70°C ±2°C
ambient
Wave Solder: 245°C ±3°C for 2-3 sec.
ΔR after 5 cycles:
-55°C ±3°C 30 min.
Room temp. 10-15 min.
+155°C ±2°C 30 min.
4 Room temp. 10-15 min.
Clamped in the trough of a 90°C metal-
lic v-block at specified AC potential
60-70 sec.
6
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