C-SERIES Datasheet, PDF (1/2 Pages) Ohmite Mfg. Co. – Ohmite introduces the C series

C Series
TO-126, TO-247, TO-220
and TO-264 Package Heatsinks
Ohmite introduces the C series (Pat. Pending). This
series offers high performance, low cost and a
compact heat sink with an integrated camming clip
system for TO-126, TO-220, TO-247 and TO-264
devices. This powerful heat sink provides tool and
fixture free assembly operation, largest surface areas
and smallest space occupation. It is the ideal type of
heat sink for high power density and small size (1U
or 2U) electronic packaging with forced convection
cooling.
SERIES SPECIFICATIONS

Heatsink
Part Number
C247-025
C247-050
C247-075
C264-030
C264-058
C264-085
C220-025
C220-050
C220-075
C126-025
C126-040
C126-050
C126-075
Surface
Area
(in²/mm²)
Weight Length “L”
(oz/g)
(mm)
11 / 7,312
0.5 / 15
25
23 / 14,858 1.1 / 31
50
34 / 21,655 1.6 / 45
75
13 / 8,774
0.7 / 19
30
25 / 16,963 1.35 / 37 58
37 / 24,861 1.97 / 54 85
11 / 7,312
0.5 / 15
25
23 / 14,858 1.1 / 31
50
34 / 21,655 1.6 / 45
75
10.2 / 6,559 0.45 / 12.7 25
16.3 / 10,495 0.72 / 20.3 40
20.4 / 13,119 0.90 / 25.4 50
30.6 / 21,655 1.35 / 38.1 75
F E AT U R E S
• Minimum assembly cost and labor Spring Clips
make the mounting holes, fasteners, tools and
fixtures obsolete in assembly operations & reduce
costs.
• Maximum Thermal Transfer Maximum surface area
per unit volume, efficient cooling fins & consistent
mounting force reduces thermal resistance.
• Maximum Repeatability Constant spring force over
repeated assembly/disassembly.
• Maximum Reliability Resilient spring action locks
electronic component in place. Fewer parts in
assembly and no fasteners and washers required.
Prevent short circuit by eliminating metal particles
generated from hardware or thread tapping.
• Design Flexibility Maximum flexibility for dynamic
device locations and power upgrading. “Configure-
to-Fit” gives designers total freedom to configure
heat sink needed to fit into a multitude design envi-
ronments.
c h aracter i st i cs
Heat Sink Aluminum Alloy 6063-T5 or Equivalent
with either degreased or black anod-
ized finish.
Spring Clip Music Wire, Per ASTM A228 with
bright nickel plating
Solder Foot Cold-rolled Steel, Per ASTM A-366
with pure tin over copper strike. RoHS
compliant.
Interface for improvement, use thermal joint
Thermal compound, 0.005 Grafoil (TGon 800
Resistance by Laird), or phase change material
(Hi-Flow by Bergquist)
Insulator (Optional) Sil-Pad 900-S, K6 800-S
and K10 by Bergquist
Heat D i ss i pat i on
Heat dissipation is the total for ALL DEVICES attached to heatsink.
200
140
120
100
80
60
40
20
Air Velocity (ft./min.)
400
600
800
C247-025-1AE (1 device)
C247-050-2AE (2 devices)
C247-075-3AE (3 devices)
1000
9
8
7
6
5
4
3
2
1
200
38
36
34
32
30
28
26
24
Air Velocity (ft./min.)
400
600
800
TO-126/CE-S102 (25mm long)
one device w/Sil-pad 900s
0
0
0
5
10
15
Heat Dissipated, total for ALL devices (watts)
22
2
3
4
5
6
7
8
Total Heat Dissipated (watts)
168
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax [phone] • www.ohmite.com • [e-mail]
1000
12
10
8
6
4
9
10
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