74HC3G34 Datasheet, PDF (9/13 Pages) NXP Semiconductors – Triple Buffer Gate

NXP Semiconductors
74HC3G34; 74HCT3G34
Triple buffer gate
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
y
Z
8
5
pin 1 index
E
c
HE
A ^A2
A1
1
e
4
bp
wM
detail X
A
X
vM A
Q
(A3)
θ
Lp
L
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D⁽¹⁾ E⁽²⁾
e
HE
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT765-1
REFERENCES
JEDEC
JEITA
MO-187
L
Lp
Q
v
w
y
Z⁽¹⁾
θ
0.4
0.40 0.21
0.15 0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
Fig 8. Package outline SOT765-1 (VSSOP8)
74HC_HCT3G34_5
Product data sheet
Rev. 05 — 7 May 2009
© NXP B.V. 2009. All rights reserved.
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