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| LPC1850_1109 Datasheet, PDF (84/142 Pages) NXP Semiconductors – 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller | |||
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NXP Semiconductors
LPC1850/30/20/10
32-bit ARM Cortex-M3 microcontroller
9. Thermal characteristics
The average chip junction temperature, Tj (ï°C), can be calculated using the following
equation:
Tj = Tamb + ï¨PD ï´ Rthï¨j â aï©ï©
(1)
⢠Tamb = ambient temperature (ï°C),
⢠Rth(j-a) = the package junction-to-ambient thermal resistance (ï°C/W)
⢠PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 7. Thermal characteristics
VDD = 2.2 V to 3.6 V; Tamb = ï40 ï°C to +85 ï°C unless otherwise specified;
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tj(max)
maximum junction
temperature
-
-
<tbd>
ï°C
LPC1850_30_20_10
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2.2 â 9 September 2011
© NXP B.V. 2011. All rights reserved.
84 of 142
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