PCF8523_12 Datasheet, PDF (60/75 Pages) NXP Semiconductors – Real-Time Clock (RTC) and calendar

NXP Semiconductors
PCF8523
Real-Time Clock (RTC) and calendar
Table 54. Carrier tape dimensions of PCF8523 …continued
Symbol
Description
Value
Unit
SOT402-1 (TSSOP14) of PCF8523TS
A0
pocket width in x direction
6.95
mm
B0
pocket width in y direction
5.6
mm
K0
pocket depth
1.6
mm
P1
pocket hole pitch
8.0
mm
W
tape width in y direction
12.0
mm
17.2 Wafer and Film Frame Carrier (FFC) information
1.492 mm
1.449 mm
(1)
1
1
X
1
1
45 μm
straight edge
of the wafer
(1) Die marking code.
Seal ring plus gap to active circuit ~18 m. Wafer thickness 200 m.
PCF8523U: bad die are marked in wafer mapping.
Fig 43. PCF8523U wafer information
~18 μm
Saw lane
~18 μm
70 μm
detail X
013aaa232
PCF8523
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 5 July 2012
© NXP B.V. 2012. All rights reserved.
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