Z0109MN_11 Datasheet, PDF (6/15 Pages) NXP Semiconductors – Logic level four-quadrant triac

NXP Semiconductors
Z0109MN
4Q Triac
5. Thermal characteristics
Table 5.
Symbol
R_th(j-sp)
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to solder point
thermal resistance from
junction to ambient
Conditions
full cycle; see Figure 8
full cycle; printed circuit board
mounted; minimum footprint;
see Figure 6
full cycle; printed circuit board
mounted; pad area; see Figure 7
Min Typ Max Unit
-
-
15 K/W
-
156 -
K/W
-
70
-
K/W
3.8 min
1.5
min
1.5
min
(3×)
1.5
min
6.3
2.3
4.6
All dimensions are in mm
001aab508
Fig 6. Minimum footprint SOT223
36
18
60
4.6
4.5
9
10
7
15
50
001aab509
All dimensions are in mm
Printed circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
(35 um thick)
Fig 7. Printed circuit board pad area: SOT223
Z0109MN
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 05 — 22 March 2011
© NXP B.V. 2011. All rights reserved.
6 of 15