Z0103MN0 Datasheet, PDF (6/15 Pages) NXP Semiconductors – 4Q Triac Direct interfacing to logic level ICs

NXP Semiconductors
Z0103MN0
4Q Triac
3.8 min
1.5
min
1.5
min
(3×)
1.5
min
6.3
2.3
4.6
All dimensions are in mm
001aab508
Fig 6. Minimum footprint SOT223
10²
Z_th(j-sp)
(K/W)
10
36
18
60
4.6
4.5
9
10
7
15
50
001aab509
All dimensions are in mm
Printed-circuit board:
FR4 epoxy glass (1.6 mm thick),
copper laminate (35 um thick)
Fig 7. Printed-circuit board pad area SOT223
003aac210
1
10^-1
10^-2
10^-5
10^-4
10^-3
10^-2
10^-1
P
t_p
t
1
10
t_p (s)
Fig 8. Transient thermal impedance from junction to solder point as a function of pulse width
Z0103MN0
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 3 January 2011
© NXP B.V. 2011. All rights reserved.
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