PCF8531 Datasheet, PDF (5/44 Pages) NXP Semiconductors – 34 x 128 pixel matrix driver

NXP Semiconductors
PCF8531
34 x 128 pixel matrix driver
L
W
PCF8531
pitch
Y
X
Fig 4. Chip dimensions
001aag908
Table 4. Bonding pad dimensions
Pad
Pad pitch
Bump dimensions
Wafer thickness (excluding bumps)
Die size L × W
Fab 1^[1]
Fab 2^[2]
Size
Unit
70
µm
50 × 90 × 17.5 (±3)
µm
381
µm
12.23 × 1.96
mm
12.14 × 1.86
mm
[1] Fab 1 identification starts with nnnnnn, where n represents a number between 0 and 9.
[2] Fab 2 identification starts with AXnnnn, where X represents a letter and n represents a number between 0
and 9.
6.2 Pin description
PCF8531_4
Product data sheet
Table 5. Bonding pad description
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see Figure 2).
Symbol
Pad
X (µm) Y (µm) Description
-
1
5973.6 −821.7 dummy
-
2
5969.5 823.4
-
3
5899.5 823.4
-
4
5829.5 823.4
-
5
5479.5 823.4
-
6
5409.5 823.4
-
7
5059.5 823.4
-
8
4989.5 823.4
-
9
4639.5 823.4
-
10
4569.5 823.4
-
11
4219.5 823.4
-
12
4149.5 823.4
-
13
3799.5 823.4
-
14
3729.5 823.4
OSC
15
3449.5 823.4
oscillator input
[1]
Rev. 04 — 13 June 2008
© NXP B.V. 2008. All rights reserved.
5 of 44