BUK118-50DL Datasheet, PDF (5/6 Pages) NXP Semiconductors – Logic level TOPFET

Philips Semiconductors
Logic level TOPFET
MECHANICAL DATA
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-leads
Product specification
BUK118-50DL
SOT78B
E
p1
∅p
q
D1
D
mounting
base
(2)
A
A1
L1
L2
L
b1
123
b⁽¹⁾
ee
wM
Q
c
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b⁽¹⁾
b1
c
D
D1
E
e
mm
4.5 1.39 0.85 1.3
4.1 1.27 0.60 1.0
0.7
0.4
15.8
15.2
6.4
5.9
10.3
9.7
2.54
Notes
1. The positional accuracy of the terminals is controlled within zone L1 max.
2. Mounting base configuration is not defined within the dimensions E and D
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOT78B
L
15.0
13.5
L1
L2
max.
3.30
2.79
3.0
∅ p p1
q
Q
w
3.8
3.6
4.3
4.1
3.0
2.7
2.6
2.2
0.4
EUROPEAN
PROJECTION
ISSUE DATE
01-02-22
Fig.2. SOT78B (TO220AB) package¹, pin 2 connected to mounting base.
1 Refer to mounting instructions for SOT78 (TO220) envelopes. Epoxy meets UL94 V0 at 1/8". Net mass: 2 g
May 2001
5
Rev 1.900