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BT258S-800LT Datasheet, PDF (5/12 Pages) NXP Semiconductors – SCR logic level, high temperature
NXP Semiconductors
BT258S-800LT
SCR logic level, high temperature
5. Thermal characteristics
Table 4.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to
ambient
Conditions
see Figure 6
in free air
Min
Typ
Max
-
-
2
[1] -
75
-
[1] Mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint; see Figure 14.
Unit
K/W
K/W
10
Zth(j-mb)
(K/W)
1
003aac301
10−1
10−2
P
tp
δ=
T
10−3
10−5
10−4
10−3
10−2
10−1
tp
t
T
1
10
tp (s)
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width
BT258S-800LT_1
Product data sheet
Rev. 01 — 2 September 2008
© NXP B.V. 2008. All rights reserved.
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