PCF8576D_11 Datasheet, PDF (42/50 Pages) NXP Semiconductors – Universal LCD driver for low multiplex rates

NXP Semiconductors
17.2 Carrier tape information
4
pin 1 index
W
B0
PCF8576D
Universal LCD driver for low multiplex rates
A0
K0
Fig 29. Tape details
P1
direction of feed
Table 24.
Symbol
A0
B0
K0
P1
W
Carrier tape dimensions
Description
pocket width in x direction
pocket width in y direction
pocket height
sprocket hole pitch
tape width in y direction
001aaj314
Value
Unit
8.6
mm
14.5
mm
1.8
mm
12
mm
24
mm
18. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
18.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
18.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
PCF8576D
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 14 February 2011
© NXP B.V. 2011. All rights reserved.
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