PBLS2024D Datasheet, PDF (4/16 Pages) NXP Semiconductors – 20 V, 1.8 A PNP BISS loadswitch

NXP Semiconductors
PBLS2024D
20 V, 1.8 A PNP BISS loadswitch
1000
P_tot
(mW)
800
(1)
(2)
600
400
(3)
006aab507
200
0
−75
−25
25
75
(1) Ceramic PCB, Al₂O₃, standard footprint
(2) FR4 PCB, mounting pad for collector 1 cm²
(3) FR4 PCB, standard footprint
Fig 1. Per device: Power derating curves
125
175
T_amb (°C)
6. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter
Per device
R_th(j-a)
thermal resistance from
junction to ambient
Conditions
in free air
R_th(j-sp)
thermal resistance from
junction to solder point
Min Typ Max Unit
[1] _-
-
260 K/W
[2] _-
-
211 K/W
[3] _-
-
165 K/W
-
-
100 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm².
[3] Device mounted on a ceramic PCB, Al₂O₃, standard footprint.
PBLS2024D_1
Product data sheet
Rev. 01 — 20 July 2009
© NXP B.V. 2009. All rights reserved.
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