PBLS2001D Datasheet, PDF (4/16 Pages) NXP Semiconductors – 20 V PNP BISS loadswitch

NXP Semiconductors
PBLS2001D
20 V PNP BISS loadswitch
6. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter
Per device
R_th(j-a)
thermal resistance from
junction to ambient
Conditions
in free air
Min Typ Max Unit
[1] _-
-
315 K/W
[2] _-
-
236 K/W
[3] _-
-
210 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm².
[3] Device mounted on a ceramic PCB, Al₂O₃, standard footprint.
10³
Z_th(j-a)
(K/W)
10²
duty cycle =
1
0.75
0.5
0.33
0.2
0.1
0.05
10 0.02
0.01
10
006aaa415
10^−1
10^−5
10^−4
10^−3
10^−2
10^−1
1
10
10²
10³
t_p (s)
Fig 2.
FR4 PCB, standard footprint
TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse time; typical
values
PBLS2001D_2
Product data sheet
Rev. 02 — 27 August 2009
© NXP B.V. 2009. All rights reserved.
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