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LPC2361 Datasheet, PDF (34/50 Pages) NXP Semiconductors – Single-chip 16-bit/32-bit MCU; up to 128 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
9. Static characteristics
Table 5. Static characteristics
Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
VDD(3V3)
supply voltage (3.3 V) core and external rail
3.0
VDD(DCDC)(3V3) DC-to-DC converter
3.0
supply voltage (3.3 V)
VDDA
analog 3.3 V pad supply
3.0
voltage
Vi(VBAT)
input voltage on pin
VBAT
[2] 2.0
Vi(VREF)
input voltage on pin
2.5
VREF
Standard port pins, RESET, RTCK
IIL
LOW-level input current VI = 0 V; no pull-up
-
IIH
HIGH-level input current VI = VDD(3V3); no
-
pull-down
IOZ
OFF-state output
VO = 0 V; VO = VDD(3V3);
-
current
no pull-up/down
Ilatch
VI
I/O latch-up current
input voltage
−(0.5VDD(3V3)) < VI <
(1.5VDD(3V3));
Tj < 125 °C
pin configured to provide
a digital function
-
[3][4][5] 0
[6]
VO
output voltage
output active
0
VIH
HIGH-level input
2.0
voltage
VIL
LOW-level input voltage
Vhys
hysteresis voltage
VOH
HIGH-level output
IOH = −4 mA
voltage
-
0.4
[7] VDD(3V3) −
0.4
VOL
LOW-level output
IOL = −4 mA
[7] -
voltage
IOH
HIGH-level output
VOH = VDD(3V3) − 0.4 V
[7] −4
current
IOL
LOW-level output
VOL = 0.4 V
current
[7] 4
IOHS
HIGH-level short-circuit VOH = 0 V
[8] -
output current
IOLS
LOW-level short-circuit VOL = VDDA
[8] -
output current
Ipd
pull-down current
VI = 5 V
[9] 10
Ipu
pull-up current
VI = 0 V
−15
VDD(3V3) < VI < 5 V
[9] 0
Typ[1]
3.3
3.3
3.3
3.3
3.3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
50
−50
0
Max
3.6
3.6
3.6
3.6
VDDA
Unit
V
V
V
V
V
3
µA
3
µA
3
µA
100
mA
5.5
V
VDD(3V3)
V
-
V
0.8
V
-
V
-
V
0.4
V
-
mA
-
mA
−45
mA
50
mA
150
µA
−85
µA
0
µA
LPC2361_62_3
Product data sheet
Rev. 03 — 11 November 2008
© NXP B.V. 2008. All rights reserved.
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