PMEG2005AEA Datasheet, PDF (3/10 Pages) NXP Semiconductors – Very low VF MEGA Schottky barrier rectifiers

NXP Semiconductors
Very low V_F MEGA
Schottky barrier rectifiers
Product data sheet
PMEG2005AEA; PMEG3005AEA;
PMEG4005AEA
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
V_R
continuous reverse voltage
PMEG2005AEA
PMEG3005AEA
PMEG4005AEA
I_F
I_FRM
I_FSM
T_j
T_amb
T_stg
continuous forward current
repetitive peak forward current
non-repetitive peak forward current
junction temperature
operating ambient temperature
storage temperature
CONDITIONS
note 1
t_p ≤ 1 ms; δ ≤ 0.5
t_p = 8 ms; square wave
note 2
note 2
MIN.
MAX.
UNIT
−
20
V
−
30
V
−
40
V
−
0.5
A
−
3.5
A
−
10
A
−
150
°C
−65
+150
°C
−65
+150
°C
Notes
1. Refer to SOD323 (SC-76) standard mounting conditions.
2. For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses
P_R are a significant part of the total power losses. Nomograms for determination of the reverse power losses P_R and
I_F(AV) rating will be available on request.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
R_{th j-a}
thermal resistance from junction to
ambient
R_{th j-s}
thermal resistance from junction to
soldering point
CONDITIONS
in free air; notes 1 and 2
in free air; notes 2 and 3
note 4
VALUE
450
210
90
UNIT
K/W
K/W
K/W
Notes
1. Refer to SOD323 (SC-76) standard mounting conditions.
2. For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses
P_R are a significant part of the total power losses. Nomograms for determination of the reverse power losses P_R and
I_F(AV) rating will be available on request.
3. Device mounted on an FR4 printed-circuit board with copper clad 10 × 10 mm.
4. Solder point of cathode tab.
2003 Aug 20
3