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BLF6G22LS-75_10 Datasheet, PDF (3/11 Pages) NXP Semiconductors – Power LDMOS transistor
NXP Semiconductors
BLF6G22LS-75
Power LDMOS transistor
6. Characteristics
Table 6. Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
V(BR)DSS drain-source breakdown
voltage
VGS(th)
VGSq
IDSS
IDSX
gate-source threshold voltage
gate-source quiescent voltage
drain leakage current
drain cut-off current
IGSS
gfs
RDS(on)
Crs
gate leakage current
forward transconductance
drain-source on-state
resistance
feedback capacitance
Conditions
VGS = 0 V; ID = 0.5 mA
VDS = 10 V; ID = 100 mA
VDS = 28 V; ID = 690 mA
VGS = 0 V; VDS = 28 V
VGS = VGS(th) + 3.75 V;
VDS = 10 V
VGS = 11 V; VDS = 0 V
VDS = 10 V; ID = 5 A
VGS = VGS(th) + 3.75 V;
ID = 3.5 A
VGS = 0 V; VDS = 28 V;
f = 1 MHz
Min
65
1.4
1.75
-
14.9
-
-
-
-
Typ
-
2
2.16
-
18.7
-
7.3
0.14
1.5
Max
-
2.4
2.75
3
-
300
-
0.24
-
Unit
V
V
V
μA
A
nA
S
Ω
pF
7. Application information
Table 7. Application information
Mode of operation: 2-carrier W-CDMA; PAR 7 dB at 0.01 % probability on CCDF; 3GPP test
model 1; 1-64 PDPCH; f1 = 2112.5 MHz; f2 = 2122.5 MHz; f3 = 2157.5 MHz; f4 = 2167.5 MHz;
RF performance at VDS = 28 V; IDq = 690 mA; Tcase = 25 °C; unless otherwise specified; in a
class-AB production test circuit.
Symbol Parameter
Conditions
Min Typ Max Unit
Gp
IRL
ηD
IMD3
ACPR
power gain
input return loss
drain efficiency
third order intermodulation distortion
adjacent channel power ratio
PL(AV) = 17 W
PL(AV) = 17 W
PL(AV) = 17 W
PL(AV) = 17 W
PL(AV) = 17 W
17.6 18.7 -
dB
-
−9.5 −6.5 dB
28 30.5 -
%
-
−37.5 −34 dBc
-
−41.5 −38.5 dBc
7.1 Ruggedness in class-AB operation
The BLF6G22LS-75 is capable of withstanding a load mismatch corresponding to
VSWR = 10 : 1 through all phases under the following conditions: VDS = 28 V;
IDq = 690 mA; PL = 75 W (CW); f = 2170 MHz.
BLF6G22LS-75_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 14 April 2010
© NXP B.V. 2010. All rights reserved.
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