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PCF8563_11 Datasheet, PDF (27/45 Pages) NXP Semiconductors – Real-time clock/calendar
NXP Semiconductors
PCF8563
Real-time clock/calendar
11. Limiting values
Table 28. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
VDD
supply voltage
IDD
supply current
VI
input voltage
on pins SCL, SDA,
and OSCI
VO
II
IO
Ptot
VESD
output voltage
input current
output current
total power dissipation
electrostatic discharge voltage
on pins CLKOUT and INT
at any input
at any output
HBM
HVSON10 (PCF8563BS/4)
DIP8 (PCF8563P/F4)
SO8 (PCF8563T/F4)
TSSOP8 (PCF8563TS/4)
SO8 (PCF8563T/5)
TSSOP8 (PCF8563TS/5)
CDM
HVSON10 (PCF8563BS/4)
DIP8 (PCF8563P/F4)
SO8 (PCF8563T/F4)
SO8 (PCF8563T/5)
TSSOP8 (PCF8563TS/4)
TSSOP8 (PCF8563TS/5)
Ilu
Tstg
Tamb
latch-up current
storage temperature
ambient temperature
operating device
Min
0.5
50
0.5
0.5
10
10
-
[1] -
[1]
[1]
[1]
[1] -
[1]
[2] -
[2] -
[2] -
[2] -
[2] -
[2] -
[3] -
[4] 65
40
Max
Unit
+6.5
V
+50
mA
+6.5
V
+6.5
V
+10
mA
+10
mA
300
mW
3 500
V
2 000
V
2 000
V
500
V
1 000
V
1 500
V
1 500
V
1 750
V
200
mA
+150
C
+85
C
[1] Pass level; Human Body Model (HBM), according to Ref. 5 “JESD22-A114”.
[2] Pass level; Charged-Device Model (CDM), according to Ref. 6 “JESD22-C101”.
[3] Pass level; latch-up testing according to Ref. 7 “JESD78” at maximum ambient temperature (Tamb(max)).
[4] According to the NXP store and transport requirements (see Ref. 9 “NX3-00092”) the devices have to be stored at a temperature of
+8 C to +45 C and a humidity of 25 % to 75 %. For long term storage products deviant conditions are described in that document.
PCF8563
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 16 June 2011
© NXP B.V. 2011. All rights reserved.
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