UJA1079 Datasheet, PDF (26/45 Pages) NXP Semiconductors – LIN core system basis chip

NXP Semiconductors
UJA1079
LIN core system basis chip
Table 8. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
T_amb
ambient
temperature
Min
Max
Unit
−40
+125
°C
[1] A reverse diode connected between V1 (anode) and BAT (cathode) limits the voltage drop voltage from V1(+) to BAT (−).
[2] Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b.
[3] IEC 61000-4-2 (150 pF, 330 Ω).
[4] ESD performance according to IEC 61000-4-2 (150 pF, 330 Ω) has been verified by an external test house for pins BAT, LIN, WAKE1
and WAKE2. The result is equal to or better than ±6 kV.
[5] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ).
[6] V1 and BAT connected to GND, emulating application circuit.
[7] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 μH, 10 Ω).
[8] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF).
[9] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: T_vj = T_amb + P × R_th(vj-a), where R_th(vj-a) is a
fixed value to be used for the calculation of T_vj. The rating for T_vj limits the allowable combinations of power dissipation (P) and ambient
temperature (T_amb).
UJA1079_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
© NXP B.V. 2010. All rights reserved.
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