SA58671 Datasheet, PDF (22/24 Pages) NXP Semiconductors – 1.2 W/channel stereo class-D audio amplifier

NXP Semiconductors
SA58671
1.2 W/channel stereo class-D audio amplifier
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
14.3.4 Cleaning
Cleaning can be done after reflow soldering.
15. Abbreviations
Table 8. Abbreviations
Acronym
Description
DUT
Device Under Test
DVD
Digital Video Disc
EMI
ElectroMagnetic Interference
ESR
Equivalent Series Resistance
FFT
Fast Fourier Transform
LC
inductor-capacitor filter
PC
Personal Computer
PCB
Printed-Circuit Board
PDA
Personal Digital Assistant
PSRR
Power Supply Rejection Ratio
PWM
Pulse Width Modulator
USB
Universal Serial Bus
WLCSP
Wafer Level Chip-Size Package
16. Revision history
Table 9. Revision history
Document ID
Release date Data sheet status
Change notice Supersedes
SA58671_2
Modifications:
20081024
Product data sheet
-
• Table 4 “Static characteristics”:
SA58671_1
– added “I_DD(sd), shutdown mode supply current” specification
• Updated soldering information
SA58671_1
20071221
Product data sheet
-
-
SA58671_2
Product data sheet
Rev. 02 — 24 October 2008
© NXP B.V. 2008. All rights reserved.
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