PCMF1USB3SZ Datasheet, PDF (19/23 Pages) NXP Semiconductors – Common-mode EMI filter for differential channels with integrated ESD protection

NXP Semiconductors
PCMFxUSB3S series
Common-mode EMI filter for differential channels with ESD protection
WLCSP10: Solder footprint and stencil aperture
PCMF2USB3S
Hx
P
solder land (SL)
solder paste deposit (SP)
solder land plus solder paste
solder resist opening (SR)
occupied area
Dimensions in mm
P P1 SL SP SR Hx Hy
0.40 0.80 0.25 0.25 0.325 1.80 1.40
P
Hy
P1
recommend stencil thickness: 0.1 mm
15-09-09
15-09-14
Fig 28. Soldering footprint WLCSP10 (PCMF2USB3S)
WLCSP15: Solder footprint and stencil aperture
see
detail X
SL = SP
SR
detail X
pcmf2usb3s_fr
PCMF3USB3S
Hx
P
solder land (SL)
solder paste deposit (SP)
P
Hy
solder land plus solder paste
solder resist opening (SR)
occupied area
Dimensions in mm
P P1 SL SP SR Hx Hy
0.40 0.80 0.25 0.25 0.325 2.60 1.40
P1
recommend stencil thickness: 0.1 mm
15-09-09
15-09-14
Fig 29. Soldering footprint WLCSP15 (PCMF3USB3S)
see
detail X
SL = SP
SR
detail X
pcmf3usb3s_fr
PCMFXUSB3S_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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